| 发明名称 |
INTEGRATED DEVICE AND FABRICATION PROCESS THEREOF |
| 摘要 |
An integrated device includes a die attach pad, a main die, a stacked die, and a mold compound. The main die has a first (e.g., bottom) surface attached to the die attach pad and has a second (e.g., top) surface. The stacked die is attached to the second surface of the main die using, for example, an adhesive film. The main die and the stacked die include silicon crystal. The mold compound encapsulates the die attach pad, the main die, and the stacked die. |
| 申请公布号 |
US2014217613(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201313757183 |
申请日期 |
2013.02.01 |
| 申请人 |
O2MICRO INC. |
发明人 |
UDREA-SPENEA Marian;MARINESCU Viorel Alexandru;CHUANG Yu Hsien |
| 分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated device comprising:
a die attach pad; a main die having a first surface attached to said die attach pad, having a second surface opposite said first surface, and having circuitry formed therein at said second surface; a stacked die attached to said second surface using an adhesive film, wherein said main die and said stacked die comprise silicon crystal; and a mold compound that encapsulates said die attach pad, said main die, and said stacked die, wherein said stacked die shields said circuitry at said second surface from said mold compound. |
| 地址 |
Santa Clara CA US |
