发明名称 |
Method and Apparatus for a Seal Ring Structure |
摘要 |
A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers. |
申请公布号 |
US2014217557(A1) |
申请公布日期 |
2014.08.07 |
申请号 |
US201313759549 |
申请日期 |
2013.02.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Chen Ting-Ying;Chiu Yi Hsun;Su Ching-Hou;Ni Chyi-Tsong |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus comprising:
a pair of bonded wafers, at least one of the wafers having a plurality dies formed thereon; a plurality of die seal rings, wherein each of the die seal rings is formed around a respective one each of the plurality of dies; and a wafer seal ring between the bonded wafers, the wafer seal ring having a uniform width, wherein the wafer seal ring is formed to surround the plurality of die seal rings. |
地址 |
Hsin-Chu TW |