METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE MANUFACTURED BY THE SAME

摘要

A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step.

主权项

1. A method of manufacturing a component-embedded substrate, comprising:
an adhesive layer forming step of forming an adhesive layer on a metal layer formed on a supporting plate; and a component mounting step of mounting an electric or electronic component on said adhesive layer, wherein said component includes a component main body and a protrusion that protrudes beyond the component main body toward said adhesive layer; the adhesive layer formed in said adhesive layer forming step includes at least a first adhesive body and a second adhesive body, said first adhesive body is formed only at a position corresponding to said protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of said component facing said adhesive layer after said first adhesive body is cured, a part of said adhesive layer formed by said first adhesive body is a projection part, a part of said adhesive layer formed by said second adhesive body alone is a recess part, which has a lower height than said projection part; and said component is mounted with said protrusion aligned with said first adhesive body in said component mounting step.