| 摘要 |
<p>The present invention relates to a light emitting diode package. Particularly, the purpose of the present invention is to provide a light emitting diode package in which a reflection part, which is laminated on the upper surface of a base part having a light emitting diode chip mounted thereon, is formed integrally with the base part, and the reflection part and the base part are made of metal; and a manufacturing method therefor. For this purpose, the light emitting diode package according to the present invention comprises the metallic base part having a mounting section on which the light emitting diode chip is mounted; the metallic reflection part having a through hole in the center thereof and laminated on the upper surface of the base part in such a manner that the end of one side of the reflection part is bent in the state of being connected with the end of one side of the base part; a terminal part arranged in parallel with the base part and separated from the base part and the reflection part at regular intervals; and an insulator inserted between the base part and the terminal part and between the reflection part and the terminal part, thereby insulating and fixing the base part, the reflection part and the terminal part.</p> |
