发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device which can suppress debris caused by radiation of a laser beam from being stuck to an objective lens or a driving shaft.SOLUTION: A laser processing device comprises: a chuck table 30 which holds a workpiece on a buildup area; laser beam radiation means 10 which irradiates the workpiece held on the chuck table 30 with laser beam L to process the workpiece; enclosing means 40 which is erected in a direction perpendicular to the buildup area and surrounds the chuck table 30; and exhaust means 50 which exhausts atmosphere in the region A segmented by the enclosing means 40. The enclosing means 40 comprises positioning means which can advance and retreat between an action position where the segmented region A is formed on the buildup area and a retreat position where the workpiece is attached or detached to the chuck table 30.
申请公布号 JP2014140856(A) 申请公布日期 2014.08.07
申请号 JP20130009647 申请日期 2013.01.22
申请人 DISCO ABRASIVE SYST LTD 发明人 NAGAMATSU JUN
分类号 B23K26/16;B23K26/10;H01L21/301 主分类号 B23K26/16
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