发明名称 |
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE AND TERMINAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for an electronic/electrical device that is excellent in resistance property to stress relaxation and balance of proof stress and bending, has excellent bending workability even for bending so that a bending axis extends in a direction perpendicular to a rolling direction, and is suitable for a conductive component for an electronic/electrical device.SOLUTION: A copper alloy for an electronic/electrical device contains more than 2.0 mass% and 15.0 mass% or less of Zn, 0.10 mass% or more and 0.90 mass% or less of Sn, 0.05 mass% or more and less than 1.00 mass% of Ni, 0.001 mass% or more and less than 0.100 mass% of Fe and 0.005 mass% or more and 0.100 mass% or less of P, and the balance is composed of Cu and inevitable impurities. The copper alloy satisfies 0.002≤Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0 and 0.10<Sn/(Ni+Fe)<5.00 in terms of atomic ratio, and has a yield ratio YS/TS of higher than 90% that is calculated from a strength TS and a 0.2% proof stress YS obtained when a tensile test is performed in a direction parallel to a rolling direction. |
申请公布号 |
JP2014141741(A) |
申请公布日期 |
2014.08.07 |
申请号 |
JP20130252331 |
申请日期 |
2013.12.05 |
申请人 |
MITSUBISHI MATERIALS CORP;MITSUBISHI SHINDOH CO LTD |
发明人 |
MAKI KAZUMASA ; MORI HIROYUKI ; YAMASHITA DAIKI |
分类号 |
C22C9/04;C22F1/00;C22F1/02;C22F1/08;H01B1/02;H01B5/02;H01R13/03 |
主分类号 |
C22C9/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|