| 摘要 |
A subtle vortex polishing apparatus includes a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit. The workpiece to be polished and the fluid abrasive are placed in the in the receiving unit. The stirring unit is driven by the transmission unit so that the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity. |
