| 发明名称 |
HIGH IMPACT TOUGHNESS SOLDER ALLOY |
| 摘要 |
High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities. |
| 申请公布号 |
US2014219711(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201214236432 |
申请日期 |
2012.08.02 |
| 申请人 |
Pandher Ranjit;Singh Bawa;Sarkar Siuli;Chegudi Sujatha;Kumar Anil K.N.;Chattopadhyay Kamanio;Lodge Dominic;de Avila Ribas Morgana |
发明人 |
Pandher Ranjit;Singh Bawa;Sarkar Siuli;Chegudi Sujatha;Kumar Anil K.N.;Chattopadhyay Kamanio;Lodge Dominic;de Avila Ribas Morgana |
| 分类号 |
B23K35/26;B23K1/005;B23K1/002 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An alloy, preferably a lead-free solder alloy, comprising:
from 35 to 59% wt Bi; from 0 to 1.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of:
from greater than 0 to 1.0% wt Al;from 0.01 to 1.0% wt Ce;from greater than 0 to 1.0% wt Co;from greater than 0 to 1.0% wt Cu;from 0.001 to 1.0% wt Ge;from greater than 0 to 1.0% wt Mg;from greater than 0 to 1.0% wt Mn;from 0.01 to 1.0% wt Ni; andfrom greater than 0 to 1.0% wt Ti, and the balance Sn, together with any unavoidable impurities. |
| 地址 |
Plainsboro NJ US |
