| 发明名称 |
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AS WELL AS PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AND USE THEREOF |
| 摘要 |
A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps:
providing at least two elements of insulating materialcoupling or connecting the elements of insulating material on at least one adjacent side surfacecovering the elements of insulating material with a layer of conductive material on at least one surfacebuilding up at least one further layer of the printed circuit board at least partly on the elements of insulating material,
wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties.
;Furthermore a printed circuit board or sub-assembly thereof is provided. |
| 申请公布号 |
US2014216793(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201214232982 |
申请日期 |
2012.07.12 |
| 申请人 |
Sebanz Simon;Voraberger Hannes |
发明人 |
Sebanz Simon;Voraberger Hannes |
| 分类号 |
H05K1/02;H05K3/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a printed circuit board or a sub-assembly thereof comprising the following steps:
providing at least two elements of insulating material coupling or connecting the elements of insulating material on at least one adjacent side surface covering the elements of insulating material with a layer of conductive material on at least one surface building up at least one further layer of the printed circuit board at least partly on the elements of insulating material, wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties and in that the at least one further layer of the printed circuit board is at least partly overlapping different elements of insulating material. |
| 地址 |
Leoben AT |
