BACKLIGHT SOURCE AND METHOD FOR MANUFACTURING BACKLIGHT SOURCE

摘要

A backlight source and a method for manufacturing the backlight source. The backlight source comprises a PCB (6) and a plurality of LEDs (5), wherein the PCB (6) comprises a base layer (61), a dielectric layer (62), a conductive layer (63), and an insulating layer (64); the PCB (6) is divided into a light bar region (7) and a heat dissipation region (8); and the conductive layer (63) is divided into a first conductive region (66) and a second conductive region (67) which are mutually insulated. The method for manufacturing the backlight source comprises: forming the base layer (61), the dielectric layer (62), and the conductive layer (63) which are sequentially laminated from bottom to top to obtain a PCB blank; dividing the PCB blank into the light bar region (7) and the heat dissipation region (8); dividing the conductive layer (63) into the first conductive region (66) and the second conductive region (67) which are mutually insulated; etching the second conductive region (67) to form a preset conductive circuit; spraying insulating paint above the conductive layer (63) to form the insulating layer (64) which is made into the PCB (6); and arranging the LEDs (5) in the light bar region (7) and being electrically connected with the second conductive region (67), wherein the conductive layer (63) is divided into the first conductive region (66) and the second conductive region (67), the first conductive region (66) and the second conductive region (67) are mutually insulated and are respectively located on the heat dissipation region (8) and the light bar region (7), and by remaining the first conductive region (66) on the heat dissipation region (8), the heat dissipation capability of the backlight source is enhanced.