POLISHING DEVICE, METHOD FOR APPLYING POLISHING PAD, AND METHOD FOR REPLACING POLISHING PAD

摘要

The present invention facilitates replacement of polishing pads and inhibits the polishing table from suffering a thermal damage. This polishing device (100) is equipped with a polishing table (110) having a receiving surface (110a) to which a polishing pad (108) for polishing a substrate (102) is to be applied. The polishing device (100) is further equipped with a silicone layer (111) formed on the receiving surface (110a) of the polishing table (110) and interposed between the polishing table (110) and the polishing pad (108). By interposing the silicone layer (111), the polishing pad (108) can be easily applied and stripped off. Since the application of the silicone layer (111) to the polishing table (110) is conducted through a heat treatment at a relatively low temperature, it is possible to inhibit the polishing table (110) from suffering a thermal damage caused by the heat treatment.