POLISHING PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a polishing pad conditioner and a method for manufacturing the same. The polishing pad conditioner according to the present invention is a polishing pad conditioner for conditioning a polishing pad for polishing a semiconductor wafer, and includes a disk-shaped conditioner body, a plurality of protrusions protruding from an upper surface of the conditioner body and inclined to one side with respect to a radius of the conditioner body, a diamond member arranged on the upper surface of the conditioner body and the protrusion, for conditioning the polishing pad, and a plating layer for fixing the diamond member arranged on the upper surface of the conditioner body and the protrusion. According to the present invention, polishing efficiency can be maximized by providing a step in a substrate of the conditioner to selectively control the content of the diamond used for polishing.