发明名称 |
METHOD AND SYSTEM FOR TREATMENT OF DEPOSITION REACTOR |
摘要 |
A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation. |
申请公布号 |
US2014220247(A1) |
申请公布日期 |
2014.08.07 |
申请号 |
US201414166462 |
申请日期 |
2014.01.28 |
申请人 |
ASM IP Holding B.V. |
发明人 |
Haukka Suvi;Shero Eric James;Alokozai Fred;Li Dong;Winkler Jereld Lee;Chen Xichong |
分类号 |
C23C16/44 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
1. A method of treating a deposition reactor, the method comprising the steps of:
providing a metal halide chemistry to a reaction chamber of the deposition reactor; providing a metal CVD precursor selected from the group consisting of organometallic compound chemistry and aluminum CVD compound chemistry to the reaction chamber; forming a doped metal film comprising one or more of B, C, Si N; optionally removing the substrate; providing a treatment reactant chemistry to the reaction chamber; exposing the reaction chamber to the treatment reactant chemistry to mitigate formation of particles comprising decomposition products of the metal CVD precursor; and purging the reaction chamber. |
地址 |
Almere NL |