发明名称 METHOD AND SYSTEM FOR TREATMENT OF DEPOSITION REACTOR
摘要 A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
申请公布号 US2014220247(A1) 申请公布日期 2014.08.07
申请号 US201414166462 申请日期 2014.01.28
申请人 ASM IP Holding B.V. 发明人 Haukka Suvi;Shero Eric James;Alokozai Fred;Li Dong;Winkler Jereld Lee;Chen Xichong
分类号 C23C16/44 主分类号 C23C16/44
代理机构 代理人
主权项 1. A method of treating a deposition reactor, the method comprising the steps of: providing a metal halide chemistry to a reaction chamber of the deposition reactor; providing a metal CVD precursor selected from the group consisting of organometallic compound chemistry and aluminum CVD compound chemistry to the reaction chamber; forming a doped metal film comprising one or more of B, C, Si N; optionally removing the substrate; providing a treatment reactant chemistry to the reaction chamber; exposing the reaction chamber to the treatment reactant chemistry to mitigate formation of particles comprising decomposition products of the metal CVD precursor; and purging the reaction chamber.
地址 Almere NL