| 摘要 |
An amplifier component (1) provides a chip housing (40) and at least two amplifier elements (31, 32). Between at least two connections (51, 52 and 61, 62) of each amplifier element (31, 32), a parasitic capacitance (81, 82) is formed, wherein this parasitic capacitance (81, 82) is compensated by an inductive compensation element (2). The compensation element (2) itself is formed between two connecting contacts (101, 102) outside of the chip housing (40) by a connecting lug (2). |
