| 摘要 |
The present invention relates to a substrate bonding device, comprising a first chamber; a second chamber which faces the first chamber, selectively combined with the first chamber, and equipped for forming a void space therein; a first chuck interstratified between the first chamber and the second chamber and supporting a first substrate; a second chuck interstratified between the first chamber and the second chamber so as to be faced with the first chuck and supporting a second substrate which faces the first substrate between a binding material; a pressure unit bonding the first substrate and the second substrate with each other by driving at least one of the first chuck and the second chuck; and a hardened unit hardening at least parts of the binding materials; and a substrate bonding method thereof. |
