发明名称 The double-sides flexible printed circuit board with multi-layer and manufacturing method thereof
摘要 The present invention relates to a double-sided multi-layer flexible printed circuit board and a manufacturing method thereof and, more specifically, to a double-sided multi-layer flexible printed circuit board which saves manufacturing costs and reduces a resistance value by using a roll-to-roll method which prints a pattern and an insulating layer of a micro circuit, and a manufacturing method thereof.
申请公布号 KR101425986(B1) 申请公布日期 2014.08.06
申请号 KR20120145361 申请日期 2012.12.13
申请人 发明人
分类号 H05K3/46;H05K13/00 主分类号 H05K3/46
代理机构 代理人
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