| 摘要 |
The method involves fabricating a stack of reconstructed wafers, and fabricating a panel of identical passive printed circuits (200) having six interconnection levels. The printed circuits are validated and fitted to an adhesive substrate (8). The circuits are molded in an electrically insulating epoxy resin to obtain a known good reconstructed panel (KGRP). The KGRP panel is bonded with a stack of known good reconstructed wafers (KGRWs) to form a stack of KGRWs-KGRP panel assembly, where the assembly is cut along cutting lines to obtain three-dimensional (3D) electronic modules. |
