A heating/cooling module for a molding system includes a mold surface forming a part of a mold cavity. A cooling unit is disposed adjacent to the mold surface for cooling the mold surface. A layered heater is disposed adjacent to the mold surface for heating the mold surface.
申请公布号
EP2761974(A2)
申请公布日期
2014.08.06
申请号
EP20120790699
申请日期
2012.09.28
申请人
WATLOW ELECTRIC MANUFACTURING COMPANY
发明人
WALLINGER, MARTIN;SCHEFBANKER, GERHARD;POSCHL, WOLFGANG;ANTOSCH, GERNOT;LEHNERT, REINHARDT;KUBLER, MICHAEL;BURR, AUGUST
