| 摘要 |
A circuit board system according to the invention comprises a circuit board (101), at least one electrical component (102), and a conductor part (103) in heat conducting relation with the electrical component. A surface of the circuit board comprises a portion (104) that is uneven so as to increase the surface area of the portion. The portion is coated with a coating (105) made of conductor material so that a surface of the coating is uneven. The circuit board comprises a heat conductive pathway (106) made of conductor material and extending from the conductor part to the coating. Thus, the coating operates as a cooling element for cooling the electrical component. |
