Ambient temperature wire bonding method, as well as the device obtained thereby

摘要

A wire bonding method wherein a gold alloy bond wire (244) with a diameter of less than about 25.4 ¼m is ball bonded to a gold alloy contact pad (218) without heating the underlying bonding pad (218) by using an ultrasonic bonding frequency greater than 60kHz and less than 200kHz. The ball bonding method allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles. Also describes an electronic storage device slider comprising a printed circuit board (234) and a bar (232) of microelectronic devices (226) wherein said method is used for obtaining the electrical connection between said parts.