| 摘要 |
An electronic device has a printed substrate 2 having land electrodes 1a, 1b and a chip-type electronic component 5 having external electrodes 4a, 4b formed on a surface of a component element body 3. The land electrodes 1a, 1b and the external electrodes 4a, 4b are bonded via a solder 6 to form electrode bonding parts 7a, 7b. A thermosetting resin 8 is filed between the electrode bonding parts 7a, 7b. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1-T3 < 50. This realizes an electronic device having a good mechanical strength, a good electrical connection property, and good insulation reliability, a bonding material suitable for fabrication of this electronic device, and a method for producing an electronic device using this bonding material. |
