Integrated circuit film and method for manipulating the same

摘要

An integrated circuit film comprising a circuit board and a control circuit is provided. The circuit board has an IC-installation part and a contact part and having a first surface and a second surface opposite to the first surface. The contact part comprises a first set of pads and a second set of pads. The first set of pads are located on the first surface for communicating with an electrical communication device. The second set of pads are located on the second surface for communicating with a smart card. The control circuit is mounted on the IC-installation part for communicating with the electrical communication device through one of the first set of pads configured in accordance with a single wire protocol (SWP), a communication protocol.