| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-density lead frame with a configuration that can reduce the length of a metal wire used for wire bonding and prevent a bonding error. SOLUTION: The lead frame includes: an island; and a plurality of inner leads extending radially from a periphery of the island. A pitch of the inner leads is equal to or smaller than 130μm, the width of a tip of each of the inner leads is larger at a bonding surface than at a rear face of the bonding surface, and each of the inner leads is fixed by using a tape from the rear face of the bonding surface so that the tape is positioned just under a bonding position. COPYRIGHT: (C)2012,JPO&INPIT |
