| 摘要 |
The present invention relates to a laser marking apparatus and, more specifically, to a laser marking apparatus capable of performing a laser marking on substrates inserted to a plurality of lines. According to the present invention, regarding a laser marking apparatus used for an SMT process, by differently combining a plurality of insertion holes and at least one discharge hole, the number of the laser marking apparatus can be fewer than the number of the production lines, thus increasing work efficiency and reducing facility costs. |
