Wafer polishing apparatus and method

摘要

An apparatus and method of polishing a substrate (W) is described. The polishing includes: rotating a substrate (W); pressing a first polishing tool (2A) against an edge portion of the substrate (W) to polish the edge portion; and pressing a second polishing tool (2B) against the edge portion of the substrate (W) to polish the edge portion. The second polishing tool (2B) is located more inwardly than the first polishing tool (2A) with respect to a radial direction of the substrate (W). The first polishing tool (2A) has a polishing surface rougher than a polishing surface of the second polishing tool (2B).