| 发明名称 |
ULTRASONIC ENERGY FOR ADHESIVE BONDING |
| 摘要 |
<p>An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.</p> |
| 申请公布号 |
EP2108029(B1) |
申请公布日期 |
2014.08.06 |
| 申请号 |
EP20070869764 |
申请日期 |
2007.12.21 |
| 申请人 |
DOW GLOBAL TECHNOLOGIES LLC |
发明人 |
SIAVOSHANI, SAEED, J.;MAHDI, SYED, Z. |
| 分类号 |
C09J5/06;B29C65/08;B29C65/48;B29C65/50;B29C65/72;B29K105/24;B29L31/30 |
主分类号 |
C09J5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
