| 摘要 |
<p>A semiconductor light emitting device package and a manufacturing method thereof are provided to form a structure for an air gap without an additional process by protruding an end of an electrode pattern from an upper part of the substrate. A semiconductor light emitting device package includes a semiconductor light emitting package device structure and a lens(300). A semiconductor light emitting device is mounted on the semiconductor light emitting device package. A first electrode pattern(150) and a second electrode pattern(160) are electrically connected to the semiconductor light emitting device. The ends of the first and second electrodes are protruded from the upper surface of the substrate. A lens structure is formed in the upper part of the first and second electrode patterns.</p> |
