| 摘要 |
The present invention relates to a method and an apparatus for inspecting a defect of a clamp and a hanger for an electroplating apparatus and, more specifically, to a method and an apparatus for inspecting a defect of a clamp and a hanger for an electroplating apparatus to detect a defective hanger more accurately by inspecting the gripping force of the clamp, and the current applying amount of the hanger and the clamp. According to the present invention, the method for inspecting a defect of a clamp and a hanger for an electroplating apparatus comprises: a hanger current applying amount measuring step for measuring the current applying amount between a hanger moved along a rail installed along a plating transfer line, and the rail for applying a current to the hanger; a clamp current applying amount measuring step for measuring the current applying amount of a clamp installed in the hanger to grip a substrate, and to transfer the current provided from the hanger to the substrate; and a gripping force measuring step for measuring the gripping force of the clamp. Unless at least one measured value measured from the hanger current applying amount measuring step, the clamp current applying amount measuring step, and the gripping force measuring step is in the preset allowable range, the defect of a product is determined. |
