摘要 |
<p>A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70 - 98% of Bi, a total of 0 - 0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.</p> |
申请人 |
SENJU METAL INDUSTRY CO., LTD.;MURATA MANUFACTURING CO., LTD. |
发明人 |
WATANABE, SHIZUHARU;TAKAOKA, HIDEKIYO;NAKANO, KOSUKE;SEINO, MASAFUMI;INABA, KO |