摘要 |
<p>A cutting element includes a table of superhard material 20, such as diamond, bonded to a substrate 30, wherein the table 20 defines a cutting edge and has a chamfered peripheral edge 21. A groove 24 in a sidewall of the cutting element passes through the chamfered peripheral edge 21, so as to reduce the depth of the chamfer at the location of the groove 24. The grooves 24 are preferably parallel to the axis of the cutting element.</p> |