Implementing selective rework for chip stacks and silicon carrier assemblies

摘要

A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.

主权项

1. An apparatus for implementing selective rework for chip stacks comprising:
a chip stack including a plurality of chips; a chip in a chip stack; a backside metal layer on said chip; said backside metal layer for creating resistive heating; a rework tool in physical engagement with said backside metal layer; a rework tool controller coupled to said rework tool for applying a predefined current to the backside metal layer to reflow solder connections on said chip backside and for separating selected chips in said chip stack.