发明名称 |
Modulation circuit with balun shielding |
摘要 |
A module includes a substrate including an IC disposed on an upper surface side thereof. The IC includes a modulation circuit unit arranged to modulate a baseband signal into an RF signal and a demodulation circuit unit arranged to demodulate an RF signal into a baseband signal. The substrate includes a first wiring layer provided on the upper surface side, a second wiring layer disposed on a lower surface side of the first wiring layer, and an insulator layer disposed between the first wiring layer and the second wiring layer. A baseband signal-use wiring pattern is provided in the first wiring layer, an RF signal-use wiring pattern is provided in the second wiring layer, and on one surface of the insulator layer, a substantially flat-plate ground electrode pattern is arranged to cover substantially an entire surface. A balun is provided in the second wiring layer. |
申请公布号 |
US8797117(B2) |
申请公布日期 |
2014.08.05 |
申请号 |
US201113169095 |
申请日期 |
2011.06.27 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Shimakawa Junya |
分类号 |
H03H7/38;H03H7/42;H03H1/00;H03H5/00 |
主分类号 |
H03H7/38 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A module comprising:
a substrate including an IC disposed on an upper surface side thereof, the IC including a modulation circuit unit arranged to modulate a baseband signal into an RF signal and a demodulation circuit unit arranged to demodulate an RF signal into a baseband signal; wherein the substrate includes a first wiring layer provided on the upper surface side, a second wiring layer disposed on a lower surface side of the first wiring layer, and an insulator layer disposed between the first wiring layer and the second wiring layer; a baseband signal-use wiring pattern is provided in the first wiring layer; an RF signal-use wiring pattern is provided in the second wiring layer; on one surface of the insulator layer, a substantially flat-plate ground electrode pattern is arranged to cover substantially an entire surface thereof; at least a balun is provided in the second wiring layer and defined by the RF signal-use wiring pattern; when viewed in a top view, at least a portion of the RF signal-use wiring pattern defining the balun is arranged on an upper surface side of the second wiring layer so as to surround a connecting wiring that electrically connects an RF terminal of the IC and a balanced-side terminal of the balun to each other; a matching circuit is provided in the second wiring layer, and when viewed in the top view, the matching circuit is surrounded by the RF signal-use wiring pattern defining the balun; the RF terminal and the balanced-side terminal are connected to each other via the connecting wiring through the matching circuit; and the matching circuit includes at least one coil. |
地址 |
Kyoto JP |