| 摘要 |
<p>An embodiment provides a package having high sealing property capable of maintaining high characteristic impedance without damaging electric power capability. According to the embodiment, the package includes a conductive base plate, a metal wall configured to be disposed on the conductive base plate and formed therein with a through-hole, and a feed through part disposed in a through-hole. The feed through part includes a lower layer feed through disposed on the conductive base plate, a wire pattern disposed on the lower layer feed through, an upper layer feed through disposed on a part of the lower layer feed through and a part of the wire pattern, and a terminal disposed on the wire pattern. A part of the lower layer feed through is larger than that of the through-hole. The lower layer feed through is adhered to a side of the metal wall. A part of the upper layer feed through is larger than that of the through-hole. The upper layer feed through is adhered to the side of the metal wall. A gap is formed between the wire pattern and an inner wall of the through-hole.</p> |
