Semiconductor structure

摘要

Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.

主权项

1. A method comprising:
forming one or more metrology structure, during formation of a device in a chip area; venting the one or more metrology structure after formation of the device; forming at least one of an insulator and conductor material over the sacrificial material and the one or more metrology structure; forming at least one vent hole in the at least one of insulator and conductor material to expose the sacrificial material and the one or more metrology structure; and sealing the at least one vent hole over the vented sacrificial material after the venting, wherein: the one or more metrology structure and sacrificial material are vented through the at least one vent hole; the device is a Micro-Electro-Mechanical System (MEMS) structure, and the one or more metrology structure is formed simultaneously with the sacrificial material used to form one or more cavities of the MEMS structure.