Connection structure, power module and method of manufacturing the same

摘要

In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.

主权项

1. A connection structure having a radiator plate, a first insulating layer, a metal pad, and a terminal sequentially laminated in this order,
wherein a first region and a second region exist between the metal pad and the terminal; wherein a buffer metal layer, which is formed of one of tin or indium, is interposed between the metal pad and the terminal in the first region, and the metal pad and the terminal directly connect at the second region, wherein the first region includes a region just below an edge of the terminal, and wherein the metal pad and the terminal are connected by an ultrasonic bond.