发明名称 Methods of integrated shielding into MTJ device for MRAM
摘要 Methods and apparatus for shielding a shielding a non-volatile memory, such as shielding a magnetic tunnel junction (MTJ) device from a magnetic flux are provided. In an example, a shielding layer is formed adjacent to an electrode of an MTJ device, such that the shielding layer substantially surrounds a surface of the electrode, and a metal line is coupled to the shielding layer. The metal line can be coupled to the shielding layer by a via.
申请公布号 US8796046(B2) 申请公布日期 2014.08.05
申请号 US201314036354 申请日期 2013.09.25
申请人 QUALCOMM Incorporated 发明人 Chen Wei-Chuan;Li Xia;Kang Seung Hyuk
分类号 H01L21/00;H01L29/82;G11C11/16;H01L27/22;H01L27/115;H01L43/08 主分类号 H01L21/00
代理机构 代理人 Talpalatsky Sam;Pauley Nicholas J.;Agusta Joseph
主权项 1. A method for protecting a magnetic tunnel junction (MTJ) device by utilizing an integrated shielding apparatus, comprising: forming the MTJ device on a substrate, wherein the MTJ device comprises: a first electrode;one or more pinned layers on the first electrode;a barrier layer on the one or more pinned layers;one or more free layers on the barrier layer;one or more hardmask layers on the one or more free layers; anda second electrode on the one or more hardmask layers; forming a shielding layer on a side surface of the second electrode, such that the shielding layer shields the one or more free layers, wherein the shielding layer does not substantially surround the side surface; and forming a metal line connection on the shielding layer.
地址 San Diego CA US