发明名称 |
Methods of integrated shielding into MTJ device for MRAM |
摘要 |
Methods and apparatus for shielding a shielding a non-volatile memory, such as shielding a magnetic tunnel junction (MTJ) device from a magnetic flux are provided. In an example, a shielding layer is formed adjacent to an electrode of an MTJ device, such that the shielding layer substantially surrounds a surface of the electrode, and a metal line is coupled to the shielding layer. The metal line can be coupled to the shielding layer by a via. |
申请公布号 |
US8796046(B2) |
申请公布日期 |
2014.08.05 |
申请号 |
US201314036354 |
申请日期 |
2013.09.25 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Chen Wei-Chuan;Li Xia;Kang Seung Hyuk |
分类号 |
H01L21/00;H01L29/82;G11C11/16;H01L27/22;H01L27/115;H01L43/08 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
Talpalatsky Sam;Pauley Nicholas J.;Agusta Joseph |
主权项 |
1. A method for protecting a magnetic tunnel junction (MTJ) device by utilizing an integrated shielding apparatus, comprising:
forming the MTJ device on a substrate, wherein the MTJ device comprises:
a first electrode;one or more pinned layers on the first electrode;a barrier layer on the one or more pinned layers;one or more free layers on the barrier layer;one or more hardmask layers on the one or more free layers; anda second electrode on the one or more hardmask layers; forming a shielding layer on a side surface of the second electrode, such that the shielding layer shields the one or more free layers, wherein the shielding layer does not substantially surround the side surface; and forming a metal line connection on the shielding layer. |
地址 |
San Diego CA US |