Method of fabricating a polarized color filter

摘要

A method of fabricating a polarized color filter wherein a transparent substrate is provided and coated with a photoresist layer. A wave-shaped mask may then be prepared and a periodic wave-shaped surface may be placed in contact with the photoresist layer, treating the photoresist layer with a primary exposure process. An external force may be applied to the wave-shaped mask, and the transparent substrate or wave-shaped mask by be rotated by a predetermined degree. The photoresist layer may be treated with a secondary exposure process, wherein the photoresist layer is developed in order to obtain a photoresist pattern layer. A metal layer may be coated on the transparent substrate with the photoresist pattern layer. The photoresist pattern layer and the portion of the metal layer on the photoresist pattern layer may then be removed such that the remaining metal layer forms a periodic hole substrate.

主权项

1. A method of fabricating a polarized color filter, comprising:
providing a transparent substrate, wherein the transparent substrate is coated with a photoresist layer; preparing a wave-shaped mask, wherein the wave-shaped mask comprises a periodic wave-shaped surface and a plate-shaped surface opposite to the periodic wave-shaped surface, and the wave-shaped mask comprises an elastomeric transparent substrate and a light-penetrable thin film layer, in which the light-penetrable thin film layer is disposed on an upper surface of the elastomeric transparent substrate, and the light-penetrable thin film layer and the upper surface of the elastomeric transparent substrate are in periodic wave shape; making the periodic wave-shaped surface be in contact with the photoresist layer; treating the photoresist layer with a primary exposure process to obtain a first exposure zone; applying an external force to the wave-shaped mask to deform the wave-shaped mask; rotating the transparent substrate by a predetermined degree; treating the photoresist layer with a secondary exposure process to obtain a second exposure zone; developing the photoresist layer to obtain a photoresist pattern layer; coating a metal layer on the transparent substrate with the photoresist pattern layer; and removing the photoresist pattern layer and a portion of the metal layer on the photoresist pattern layer; whereby the remaining metal layer forms a periodic hole structure.