Flip chip bonded semiconductor device with shelf

摘要

The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip.

主权项

1. A semiconductor device comprising a planar semiconductor chip, the planar semiconductor chip comprising:
a substrate; an underfill disposed on the substrate; a wafer flip-chip bonded onto the substrate, the wafer comprising:
a first surface mounted to the underfill;a second surface, the second surface being opposite to the first surface; anda plurality of protruding connection terminals disposed on the first surface, wherein the first surface extends beyond the second surface to form a shelf, further wherein, the shelf is configured to substantially prevent an excess portion of the underfill material from coating a plurality of side surfaces of the wafer.