Method of transferring a light emitting diode

摘要

A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

主权项

1. A method of transferring a micro LED to a receiving substrate comprising:
positioning a transfer head over a carrier substrate having an array of micro LED structures disposed thereon, each micro LED structure comprising:
a micro p-n diode; anda metallization layer, wherein the metallization layer is between the micro p-n diode and a bonding layer on the carrier substrate; heating the bonding layer for at least one of the micro LED structures above a liquidus temperature of the bonding layer to liquefy the bonding layer; picking up the micro p-n diode and the metallization layer for the at least one of the micro LED structures with the transfer head while the bonding layer is liquefied; and placing the micro p-n diode and the metallization layer for the at least one of the micro LED structures on the receiving substrate.