Positioning and socketing for semiconductor dice

摘要

Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

主权项

1. A device comprising,
a housing having an end mounted on an air bearing plate, an actuation member located within the housing and capable of movement along a first axis within the housing, at least one air bearing in the housing and capable of separating the actuation member from an inner side of the housing, a first motor mounted on the housing and operably connected to the actuation member and capable of causing the actuation member to move along the first axis, one or more manipulators each movably attached at a first end to the air bearing plate and movably attached at a second end to a proximate surface, a testing interface wherein the testing interface is capable of forming electrical contacts with a die mounted on the actuation member and wherein the testing interface faces a region of the actuation member that is capable of holding a die, and an optical system wherein the optical system comprises optics capable of reflecting an image of a die mounted on the actuation member and an image of the testing interface onto an imaging device capable of detecting the image of the die and the image of the testing interface.