Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)

摘要

According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.

主权项

1. An apparatus comprising:
a first array, the first array being arranged over a surface and arranged to provide cooling to the surface, the first array including a plurality of thermoelectric chips (TECs), the surface being arranged to emit radiation; at least a first sensing arrangement, the first sensing arrangement being substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface; and a controller, the controller being arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.