发明名称 |
Stacked layers of nitride semiconductor and method for manufacturing the same |
摘要 |
According to one embodiment, stacked layers of a nitride semiconductor include a substrate, a single crystal layer and a nitride semiconductor layer. The substrate does not include a nitride semiconductor and has a protrusion on a major surface. The single crystal layer is provided directly on the major surface of the substrate to cover the protrusion, and includes a crack therein. The nitride semiconductor layer is provided on the single crystal layer. |
申请公布号 |
US8796111(B2) |
申请公布日期 |
2014.08.05 |
申请号 |
US201313946898 |
申请日期 |
2013.07.19 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Sugawara Hideto;Onomura Masaaki |
分类号 |
H01L21/30;H01L33/00;H01L21/02;H01L29/20 |
主分类号 |
H01L21/30 |
代理机构 |
White & Case LLP |
代理人 |
White & Case LLP |
主权项 |
1. A method for manufacturing a semiconductor light emitting device, comprising:
forming a plurality of protrusions on a major surface of a substrate, the substrate not including a nitride semiconductor; forming a single crystal layer directly on the major surface of the substrate to cover the protrusions and to cause a crack in the single crystal layer; and forming a nitride semiconductor layer on the single crystal layer, the plurality of the protrusions being formed in a planar pattern, the protrusions extending in a prescribed crystal orientation of the substrate, and extending in a plurality of directions equivalent to the prescribed crystal orientation. |
地址 |
Tokyo JP |