发明名称 Stacked layers of nitride semiconductor and method for manufacturing the same
摘要 According to one embodiment, stacked layers of a nitride semiconductor include a substrate, a single crystal layer and a nitride semiconductor layer. The substrate does not include a nitride semiconductor and has a protrusion on a major surface. The single crystal layer is provided directly on the major surface of the substrate to cover the protrusion, and includes a crack therein. The nitride semiconductor layer is provided on the single crystal layer.
申请公布号 US8796111(B2) 申请公布日期 2014.08.05
申请号 US201313946898 申请日期 2013.07.19
申请人 Kabushiki Kaisha Toshiba 发明人 Sugawara Hideto;Onomura Masaaki
分类号 H01L21/30;H01L33/00;H01L21/02;H01L29/20 主分类号 H01L21/30
代理机构 White & Case LLP 代理人 White & Case LLP
主权项 1. A method for manufacturing a semiconductor light emitting device, comprising: forming a plurality of protrusions on a major surface of a substrate, the substrate not including a nitride semiconductor; forming a single crystal layer directly on the major surface of the substrate to cover the protrusions and to cause a crack in the single crystal layer; and forming a nitride semiconductor layer on the single crystal layer, the plurality of the protrusions being formed in a planar pattern, the protrusions extending in a prescribed crystal orientation of the substrate, and extending in a plurality of directions equivalent to the prescribed crystal orientation.
地址 Tokyo JP