发明名称 Pressure-sensitive hot-melt adhesives adhering to flexible substrates
摘要 The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.
申请公布号 US8796377(B2) 申请公布日期 2014.08.05
申请号 US200912464131 申请日期 2009.05.12
申请人 Henkel AG & Co. KGAA 发明人 Tönniessen Holger;Seiler Annie;Rauberger Rainer;Grauel Ralf
分类号 C08L53/00 主分类号 C08L53/00
代理机构 代理人 Lehmann Sun Hee
主权项 1. A hot melt pressure sensitive adhesive comprising: a) 1 to 30 wt. % of at least one ethylene-vinyl acetate copolymer with a melting temperature greater than 70° C.; b) 2 to 50 wt. % of a block copolymer that includes a styrene-isoprene-butylene copolymer, in a weight ratio of 10:1 to 1:2 to the total block copolymer, wherein the block copolymer is selected from the group consisting of styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-ethylene/butylene copolymer, styrene-ethylene/propylene-styrene copolymer, styrene-isoprene-butylene copolymer and mixtures thereof, c) 20 to 70 wt. % of a tackifying resin; and d) 5 to 40 wt. % of a plasticizer which is a mixture of at least one oil and at least one ester; wherein the sum of the adhesive components equals to 100% and wherein the hot melt pressure sensitive adhesive is characterized as re-detachable.
地址 Duesseldorf DE