| 发明名称 |
Techniques for bonding substrates using an intermediate layer |
| 摘要 |
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region. |
| 申请公布号 |
US8796109(B2) |
申请公布日期 |
2014.08.05 |
| 申请号 |
US201012977890 |
申请日期 |
2010.12.23 |
| 申请人 |
Medtronic, Inc. |
发明人 |
Ruben David A.;Sandlin Michael S. |
| 分类号 |
H01L23/10;H01L21/20 |
主分类号 |
H01L23/10 |
| 代理机构 |
|
代理人 |
Mburu Evans M. |
| 主权项 |
1. A method comprising:
depositing a thin film on a first surface of a first substrate; moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces; generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength; and directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region, wherein directing the EM radiation through one of the first and second substrates and onto the region of the thin film until the first and second substrates are fused in the region does not cause the first substrate or the second substrate to melt or flow. |
| 地址 |
Minneapolis MN US |
