Substrate processing method and substrate processing apparatus

摘要

A substrate processing apparatus according to the present invention is provided with a spin chuck (3) that holds a substrate (W) and rotates the same. A process liquid supply system (11, . . . ) is disposed to supply a process liquid to the substrate rotated by the spin chuck. There are disposed a fluid nozzle (12) that supplies to the substrate a drying fluid having a higher volatility than that of the process liquid, and an inert gas nozzle (13) that supplies an inert gas to the substrate. A nozzle moving mechanism (15, 52, . . . ) is disposed that moves the nozzles (12, 13) radially outward relative to a rotational center (Po) of the substrate, while maintaining the inert gas nozzle nearer to the rotational center of the substrate than the fluid nozzle.

主权项

1. A substrate processing method comprising:
a liquid-processing step of processing a substrate with deionized water; and a drying step of drying the substrate, wetted with the deionized water supplied in the liquid-processing step, by supplying a drying fluid and an inert gas to the substrate, while rotating the substrate with the deionized water adhering thereto due to execution of the liquid-processing step, the drying fluid having a higher volatility than that of the deionized water, wherein in the drying step, a supply position of the drying fluid to the substrate and a supply position of the inert gas to the substrate are moved radially outward from a rotational center of the substrate to a periphery of the substrate, respectively, while both the drying fluid and the inert gas are supplied to the substrate at the same time and while the supply position of the inert gas is maintained nearer to the rotational center of the substrate than the supply position of the drying fluid.