| 发明名称 | Wiring board and manufacturing method of wiring board | ||
| 摘要 | There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component. | ||
| 申请公布号 | US8797755(B2) | 申请公布日期 | 2014.08.05 |
| 申请号 | US201313958983 | 申请日期 | 2013.08.05 |
| 申请人 | Sony Corporation | 发明人 | Sato Junichi |
| 分类号 | H05K1/18;H05K1/11 | 主分类号 | H05K1/18 |
| 代理机构 | Rader, Fishman & Grauer PLLC | 代理人 | Rader, Fishman & Grauer PLLC |
| 主权项 | 1. A wiring board comprising: a first stiffener, one face of which is bonded to a circuit board; a second stiffener having a disposition hole in which an electronic component is disposed; and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component. | ||
| 地址 | Tokyo JP | ||