| 发明名称 | Distributed coupler with first line on substrate and second line in package supporting substrate | ||
| 摘要 | A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other. | ||
| 申请公布号 | US8797121(B2) | 申请公布日期 | 2014.08.05 |
| 申请号 | US201113228178 | 申请日期 | 2011.09.08 |
| 申请人 | STMicroelectronics (Tours) SAS | 发明人 | Ezzeddine Hilal;Laporte Claire |
| 分类号 | H01P5/12;H01P3/08 | 主分类号 | H01P5/12 |
| 代理机构 | Wolf, Greenfield & Sacks, P.C. | 代理人 | Wolf, Greenfield & Sacks, P.C. |
| 主权项 | 1. A distributed coupler comprising a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of said signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other, wherein ground planes are formed approximately above each other on the substrate and in the lead frame. | ||
| 地址 | Tours FR | ||