| 摘要 |
A vertical distortion of a joined substrate is suppressed by appropriately holding substrates when the substrates are joined together. A joining device includes: an upper chuck configured to draw and hold an upper wafer on a lower surface; a lower chuck provided below the upper chuck and configured to draw and hold a lower wafer on an upper surface; and a lower chuck holding unit provided below the lower chuck and configured to draw and hold the lower chuck. On a first main body portion of the lower chuck holding unit, a central protrusion, which is projected compared to the surrounding and is in contact with the lower chuck, is provided. On a second main body portion and a third main body portion of the lower chuck holding unit, a suction groove for vacuum-sucking the lower chuck is orbitally formed over a concentric circle two times. On a fourth main body portion of the lower chuck holding unit, a plurality of outer peripheral protrusions, which are projected from the surroundings and are in contact with the lower chuck, are provided. |
