发明名称 |
Hermeettisesti suljettu optoelektroninen komponentti |
摘要 |
This invention provides inexpensively hermetically packaged optoelectronic chips. Multiple similar or dissimilar optoelectronic chips can be produced according to the present methods. Additionally, the chips may include a heat sink for efficient thermal management and elements for wavelength conversion without compromising their efficiency or quality. Furthermore, optical structures are provided to allow optimization of optical performance. |
申请公布号 |
FI20126259(A) |
申请公布日期 |
2014.08.04 |
申请号 |
FI20120006259 |
申请日期 |
2012.12.03 |
申请人 |
LUMICHIP LIMITED |
发明人 |
RANTALA, JUHA;KATILA, PEKKA |
分类号 |
H01L33/52;H01L23/10;H01L33/50;H01L33/64 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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