METHODS AND APPARATUS FOR TRANSMISSION LINES IN PACKAGES

摘要

An apparatus and a method, of forming a semiconductor device package having a transmission line using a micro bump layer, are disclosed. The micro bump layer includes a micro bump which is formed between an upper device and a lower device, and a micro bump line. A signal transmission line is formed by the micro bump line on the lower device. A ground surface is formed by using an additional micro bump line or a redistribution layer (RDL) in the lower device. The ground surface having the RDL includes an open slot. The RDL is located at the lower device or the upper device on or under the micro bump line for forming a ground surface part.